TSMC Q3 Revenue Climbs 51% as ASML Plans 10% Parts Price Hike for 2027

TSMC reported consolidated revenue of about NT$511.86 billion, roughly US$16.1 billion, for September 2026, up 54.6% from NT$330.98 billion a year earlier and down 0.6% from August, with the company filing the figures on October 8. That September print carried third-quarter consolidated revenue to about NT$1.49 trillion, up 51% year on year. The scale of the increase reflects both higher wafer prices at leading nodes and a richer mix of advanced packaging attached to AI accelerators, rather than a step change in shipped wafer volume alone.

Equipment suppliers are now capturing some of that margin. According to The Elec via TrendForce, ASML has told Samsung Electronics and SK hynix through its South Korean subsidiary that it will raise prices by 10% on all replacement parts for both EUV and DUV lithography systems, effective for deliveries starting January 2027. The increase covers everything from routinely purchased consumables to major components replaced after failure or performance decline. Across-the-board increases of this size are unusual; ASML has historically adjusted individual part prices in response to raw material costs or supply shortages, and industry sources suggest the company is now seeking a larger share of customer profits.

ASML's pricing power rests on a sold-out book. Reuters reports that existing EUV machines, priced at around US$200m each, are nearly sold out through 2027, while major chipmakers are also committing to next-generation High-NA EUV systems at roughly US$400m each. The company earned EUR8.193bn from services, replacement parts and upgrades for installed equipment last year, about 25% of its EUR32.667bn total revenue, and expects that business to grow more than 30% this year. Reports also indicate ASML has discussed higher prices for newly ordered lithography equipment, having sought a 10% increase on DUV tools from some Chinese customers, while TSMC is said to be resisting increases on both EUV and DUV systems.

The squeeze is industry-wide and increasingly a lead-time problem rather than a demand problem. Applied Materials said on its August earnings call that higher prices for both new and existing products were supporting margin expansion, and Tokyo Electron said in late July that it was negotiating price adjustments including for existing models. Lead times for certain deposition equipment components have stretched from four months to as long as 10 months, and some Japanese-made components used in laser processing equipment face delivery times of up to 40 months. For foundries and memory makers planning 2027 capacity, the practical consequence is that tool slots and spares, not wafer demand, are becoming the binding constraint.