2026-05-19 a 2026-10-20 · 22 Observaciones fechadas
LPDDR5X 96Gb: 175 USD/chip al 2026-10-20. Región: Estados Unidos.
Cambio de 0 USD/chip (0%) respecto a la observación anterior del 2026-10-13.
| Fecha | Price (USD/chip) | cambio | % cambio |
|---|---|---|---|
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | +7.00 | +4.17% | |
| 168 | 0.00 | 0.00% | |
| 168 | +3.00 | +1.82% | |
| 165 | 0.00 | 0.00% | |
| 165 | 0.00 | 0.00% | |
| 165 | 0.00 | 0.00% | |
| 165 | -- | -- |
Las tablas conservan las fechas originales. No se inventan cotizaciones diarias a partir de datos mensuales o semanales. Se mantienen las lagunas; los precios estimados no se usan en páginas indexables de precios observados.
Esta serie sigue LPDDR5X 96Gb, especificación LPDDR · LPDDR5X 96Gb, en Estados Unidos, en USD/chip. Los componentes minoristas y las valoraciones mayoristas de chips usan referencias diferentes.
The available history contains 22 observations from 2026-05-19 to 2026-10-20. These are recorded dates, not proof of the earliest available publication; missing intervals are not interpolated.
No. 2026-10-20 es la última fecha registrada, no una garantía de actualización en tiempo real. Los precios públicos pueden ser tardíos, incompletos o inexactos y son solo orientativos.
ChangXin Memory Technologies forecast RMB 265-270 billion of revenue for the first nine months of 2026, more than sevenfold higher year on year, but told shareholders that third-quarter net profit growth slowed to just 1-4% sequentially as DRAM price gains moderate.
Intel's first Xe3P data-center part trades peak compute for memory capacity: 1.3 PFLOPS of FP8, 1.5 TB/s of bandwidth, 350W and up to 480GB of LPDDR5X in a standard PCIe card aimed at agentic AI.
Microsoft and Intel unveiled in-house AI accelerators with opposite memory strategies at the OCP Global Summit: Maia 300 moves to eight HBM4 stacks on TSMC 2nm, while Intel's new GPU D-Series uses up to 480GB of cheaper LPDDR5X.
Micron's Taiwan investment has topped NT$1.6 trillion with a second HBM advanced packaging plant in Taichung due online in October 2026 and expansion underway in Tongluo, Taoyuan and Tainan. Nanya Technology won approval for a Pingtung advanced packaging site, and Micron has told suppliers capacity will be tighter in 2027 and 2028 than in 2026.