The available history contains 22 observations from 2026-05-19 to 2026-10-20. These are recorded dates, not proof of the earliest available publication; missing intervals are not interpolated.
ChangXin Memory Technologies forecast RMB 265-270 billion of revenue for the first nine months of 2026, more than sevenfold higher year on year, but told shareholders that third-quarter net profit growth slowed to just 1-4% sequentially as DRAM price gains moderate.
Intel's first Xe3P data-center part trades peak compute for memory capacity: 1.3 PFLOPS of FP8, 1.5 TB/s of bandwidth, 350W and up to 480GB of LPDDR5X in a standard PCIe card aimed at agentic AI.
Microsoft and Intel unveiled in-house AI accelerators with opposite memory strategies at the OCP Global Summit: Maia 300 moves to eight HBM4 stacks on TSMC 2nm, while Intel's new GPU D-Series uses up to 480GB of cheaper LPDDR5X.
Micron's Taiwan investment has topped NT$1.6 trillion with a second HBM advanced packaging plant in Taichung due online in October 2026 and expansion underway in Tongluo, Taoyuan and Tainan. Nanya Technology won approval for a Pingtung advanced packaging site, and Micron has told suppliers capacity will be tighter in 2027 and 2028 than in 2026.