2026-05-19 au 2026-10-20 · 22 Observations datées
LPDDR5X 96Gb : 175 USD/chip au 2026-10-20. Région : États-Unis.
Variation de 0 USD/chip (0%) par rapport à l’observation précédente du 2026-10-13.
| Date | Price (USD/chip) | variation | % variation |
|---|---|---|---|
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | 0.00 | 0.00% | |
| 175 | +7.00 | +4.17% | |
| 168 | 0.00 | 0.00% | |
| 168 | +3.00 | +1.82% | |
| 165 | 0.00 | 0.00% | |
| 165 | 0.00 | 0.00% | |
| 165 | 0.00 | 0.00% | |
| 165 | -- | -- |
Les tableaux conservent les dates d'observation. Les données mensuelles ou hebdomadaires ne deviennent pas des cours quotidiens inventés. Les lacunes restent visibles et les prix estimés sont exclus des pages indexables de prix observés.
Cette série suit LPDDR5X 96Gb, spécification LPDDR · LPDDR5X 96Gb, en États-Unis, en USD/chip. Les prix de détail et les évaluations de puces mémoire en gros sont des références différentes.
The available history contains 22 observations from 2026-05-19 to 2026-10-20. These are recorded dates, not proof of the earliest available publication; missing intervals are not interpolated.
Non. 2026-10-20 est la dernière date enregistrée, sans garantie de mise à jour en temps réel. Les prix publics peuvent être retardés, incomplets ou inexacts et sont indicatifs.
ChangXin Memory Technologies forecast RMB 265-270 billion of revenue for the first nine months of 2026, more than sevenfold higher year on year, but told shareholders that third-quarter net profit growth slowed to just 1-4% sequentially as DRAM price gains moderate.
Intel's first Xe3P data-center part trades peak compute for memory capacity: 1.3 PFLOPS of FP8, 1.5 TB/s of bandwidth, 350W and up to 480GB of LPDDR5X in a standard PCIe card aimed at agentic AI.
Microsoft and Intel unveiled in-house AI accelerators with opposite memory strategies at the OCP Global Summit: Maia 300 moves to eight HBM4 stacks on TSMC 2nm, while Intel's new GPU D-Series uses up to 480GB of cheaper LPDDR5X.
Micron's Taiwan investment has topped NT$1.6 trillion with a second HBM advanced packaging plant in Taichung due online in October 2026 and expansion underway in Tongluo, Taoyuan and Tainan. Nanya Technology won approval for a Pingtung advanced packaging site, and Micron has told suppliers capacity will be tighter in 2027 and 2028 than in 2026.